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Silane Coupling Agents With Heat Resistance, Durability, Releasability, And Antifouling Property And Process For Producing These Compounds
More than 350 degrees C heat resistant release agent
Field Chemistry, Optical Component, Electronic Device, Electrical, Nanotechnology, Engineering Keywords Silane Coupling Agent, Fluorine System, Heat Resistance, Nanoimprint Technology
Abstracts Silane coupling agents which are so high in heat resistance, durability, releasability, and antifouling properties that no decrease in contact angle is observed even after exposure to an atmosphere having a temperature of 350 DEG C or higher for 4 hours or longer. The silane coupling agents have a biphenylalkyl group and are represented by the following general formula (1). The silane coupling agents are so high in heat resistance, durability, releasability, and antifouling properties that surfaces modified with these compounds show no decrease in contact angle when exposed to an atmosphere having a temperature of 350 DEG C or higher for 4 hours or longer. The coupling agents have an extraordinary effect and usefulness. (1) [In the formula (1), Rf represents perfluoroalkyl of F (CF2) n, wherein n is an integer of 1-14, desirably 1-12, preferably 4-12, more desirably 4-10.]
Advantages As the invention concerns a mold release showing high heat-resistance with nanometer thickness, the compound is supposed to be optimal solution for nanoimprint technology.
Inventor Prof. Norio Yoshino (Tokyo University of Science)
Patent Publication No (APPLICATION NUMBER, FILING DATE) WO200854074 (Mar. 6, 2008), JP2009-502622 (Mar. 6, 2008), CN (Mar. 6, 2008), EP08721494.6 (Mar. 6, 2008), US (Mar. 6, 2008) (PUBLICATION NUMBER, PUBLICATION DATE) WO2008108438 (Sep.12, 2008) (PRIORITY APPLICATION NUMBER, PRIORITY DATE) JP2007-0055975 (Mar. 6, 2007)
Internal file number G2007-015, T2009-027, (T2006-106)
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